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Is it possible to combine gold and boron to form compounds? A simple example being:

$$ \ce{Au + B -> AuB} $$

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  • $\begingroup$ yes. link.springer.com/chapter/10.1007%2F978-3-540-45280-5_27 $\endgroup$ – MaxW Feb 19 '17 at 22:53
  • $\begingroup$ @MaxW Thank ! is my equation correct or am i missing something ? Also is the reaction made with gaseous gold and bore ? $\endgroup$ – americium1997 Feb 19 '17 at 23:00
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    $\begingroup$ That is the overall reaction but making AuB isn't as easy as the equation would make it seem. Gold is a solid at room temperature of course. $\endgroup$ – MaxW Feb 19 '17 at 23:04
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    $\begingroup$ @MaxW yeah of course, but heating the reactants at 2075° (so the bore and gold should be liquid) (bore fusion point is 2075 and gold is 1064) and then freezing down the solution would work ? $\endgroup$ – americium1997 Feb 19 '17 at 23:08
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    $\begingroup$ I don't know how to do it. No point in me speculating and telling you wrong. But at a temperature of 2000 degrees how do you protect the material from atmospheric oxygen? What container material do you use? And so on... $\endgroup$ – MaxW Feb 19 '17 at 23:19
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Yes, gold and boron can bond with each other to form alloy clusters. They are very important in semiconductor industry and used in fabrication process. Here(1) is a short note on gold-boron alloy:

Photoelectron spectroscopy and density-functional theory are combined to investigate the electronic and structural properties of a series of $\ce{B-Au}$ alloy clusters: $\ce{B6Au_{n}^{−}}$ and $\ce{B6Au_{n}}$ ($\ce{n = 1−3}$). Rich spectral features are observed for each species, and vibrational structures are resolved for numerous detachment transitions of $\ce{B6Au^−}$ and $\ce{B6Au^{2−}}$. Electron affinities of $\ce{B6Au_{n} (n = 1−3)}$ are evaluated to be 2.70 ± 0.03, 2.91 ± 0.02, and 3.21 ± 0.05 eV, respectively. Global structural searches are performed for both the anions and their neutrals. The calculated electronic binding energies are compared with experimental measurements to establish the anion global-minimum structures and their corresponding neutral states. The ground-state structures of these clusters are shown to be planar or quasi-planar with an elongated B6core, to which the first and second Au atoms are bonded terminally and the third Au in a bridging position. All three anion clusters are π antiaromatic. Natural bond orbital analyses show that the $\ce{B-Au}$ bonding is highly covalent, providing new examples for the $\ce{Au/H}$ analogy in Au alloy clusters.

You can find more information about gold-boron alloy clusters in the reference below.

Reference

  1. The Journal of Chemical Physics 138, 084306 (2016); doi: http://dx.doi.org/10.1063/1.4792501
  2. https://www.google.com/patents/US3211550
  3. https://www.ncbi.nlm.nih.gov/pubmed/23901981
  4. http://aip.scitation.org/doi/10.1063/1.4816010
  5. https://www.researchgate.net/publication/235886590_On_the_structures_and_bonding_in_boron-gold_alloy_clusters_B6Aun-_and_B6Aun_n_1-3
  6. http://www.google.co.in/patents/US3137595
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In a rather different vein is boronizing gold for surface hardening. Here boron combines not with the gold but with a base metal alloyed into the gold. According to the abstract from* (full article behind a paywall):

Surface hardening of gold containing Ti, Zr, Hf, V, Nb, Ta, Cr, Mn, Fe, Co or Ni was tried by means of boronizing technique with powder boron under argon atmospheric furnace at 900 to 950 degree C for 6 hrs. The obvious surface hardening was possible for the gold alloy which contains more than 5%Ti, 5%V, 3%Cr, 15%Mn, 10%Fe, 5%Co or 5%Ni. Surface hardness and thickness of the hardened layer strongly depended on the alloying element added. The phases formed on the hardened surface were investigated by X-ray diffraction analysis.

Reference

*https://www.researchgate.net/publication/29677483_Surface_Hardening_of_Gold_with_Boronizing_TechniqueMaterials_Metallurgy_Weldability

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