I am trying to make a copper sulfate electroplating solution. I came across a document (Schlesinger and Paunovic 2011) which mentions the amount of copper sulfate that should be added to water to create such a solution. In Table 2.1 on the bottom of page 35, it has two columns: one for conventional solutions and one for high throw solutions.
I read another paper (Nikolova and Watkowski) which talks about high throw copper electroplating process. All I could glean from the paper was that high throw solutions enable higher aspect ratios for copper PCBs.
Please reply if anyone knows what high throw solutions are.
Nikolova, Maria, and Jim Watkowski. “INNOVATIVE HIGH THROW COPPER ELECTROPLATING PROCESS FOR METALLIZATION OF PCB.”
Schlesinger, M., and M. Paunovic. 2011. Modern Electroplating. The ECS Series of Texts and Monographs. Wiley. http://books.google.com/books?id=j3OSKTCuO00C.