I'm not a chemist but I remember that the standard HF/nitric silicon etch used in micro-fabrication supposedly worked in two steps; the HF would dissolve the thin SiO2 oxide layer on the silicon surface, exposing silicon atoms, and the nitric acid would then re-oxidize the bare silicon, allowing the HF to then dissolve it.
Or at least that's how it was explained to me.
Despite being challenged here, Wikipedia explains that the aluminum bits in sodium hydroxide-based drain cleaner are included to produce heat via exothermic liberation of hydrogen gas so that the heat can loosen some of the clogging materials. The article provides the following two steps.
Breakdown of Aluminum Oxide: $\ce{ \ \ \ Al2O3 + 2NaOH + 3H2O → 2Na [Al(OH)4]}$
Oxidation of Aluminum metal: $\ce{ \ \ \ 2Al + 2NaOH + 6H2O → 2Na[Al(OH)4] + 3H2}$
Is what is happening similar to my understanding of the HF/nitric etch of silicon; it is the oxidized aluminum that is removed by the solution, and only because it happens to also oxidize the freshly exposed aluminum metal that the oxide is removed?
Snapshot of some drain cleaner with aluminum bits