I am basically working in semiconductor industry and I specifically taking care of CMP (Chemical Mechanical Polishing). We did polish glass (borosilicate type of glass) and we are using slurry (which is cerium-based) as the chemical compound. Our polishing time was quite long (~40 min) and without chilling the slurry, it could deteriorate the polishing pad, material removal etc. I have decided to chill the slurry (CeO) at temp ~20 °C prior supply to my polishing machine.
How does this Ce chemically and mechanically impact my CMP performance? What is the agglomeration index of this Ce with the changes of temperature?
Any good article to share?